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Results for "semiconductor+packaging+design"
University of Illinois Urbana-Champaign
Skills you'll gain: Design and Product, Creativity, Product Design, Product Development, Research and Design, Entrepreneurship, Innovation, Problem Solving, Strategy and Operations, Critical Thinking, Hardware Design, Interactive Design, Product Management, Software Engineering Tools, Professional Development
Status: FreeÉcole Polytechnique
University of Colorado Boulder
Skills you'll gain: Problem Solving
University of Illinois Urbana-Champaign
Skills you'll gain: Data Analysis
Skills you'll gain: Communication
University at Buffalo
Skills you'll gain: Design and Product, Strategy and Operations, Computer Networking, Human Computer Interaction, Product Lifecycle, Computer Graphics, Data Analysis, Interactive Design, Product Management, Technical Product Management, Internet Of Things
University of Pennsylvania
Skills you'll gain: Product Design
University of California San Diego
Korea Advanced Institute of Science and Technology(KAIST)
University of Colorado Boulder
Skills you'll gain: Computer Architecture, Computer Networking, Internet Of Things, Cloud Computing, Amazon Web Services, Cloud Applications, Cloud Platforms, Cloud Standards, Network Architecture, Software Engineering
University at Buffalo
Skills you'll gain: Cyberattacks, Network Security, Security Engineering, Security Software, System Security, Computer Networking, Computer Security Incident Management, Computer Security Models, Security Strategy, Software Security
In summary, here are 10 of our most popular semiconductor+packaging+design courses
- 3D Printing and Additive Manufacturing:Â University of Illinois Urbana-Champaign
- Plastic electronics: École Polytechnique
- Semiconductor Physics:Â University of Colorado Boulder
- VLSI CAD Part II: Layout:Â University of Illinois Urbana-Champaign
- Designing an SAP Solution:Â SAP
- Digital Thread: Implementation:Â University at Buffalo
- Fundamentals of Digital Design for VLSI Chip Design:Â L&T EduTech
- Design: Creation of Artifacts in Society:Â University of Pennsylvania
- Human-Centered Design: an Introduction:Â University of California San Diego
- Introduction to Semiconductor Devices 1:Â Korea Advanced Institute of Science and Technology(KAIST)
