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Results for "integrated+circuit+packaging+materials"
Arizona State University
Skills you'll gain: Semiconductors, Electronic Components, Failure Analysis, Basic Electrical Systems, Electrical Engineering, Structural Analysis, Manufacturing Processes, Process Control, Process Analysis, Engineering Analysis, Spatial Analysis, Systems Of Measurement, Data Analysis Software, Science and Research, Estimation, Physics, Experimentation, General Science and Research, Simulations
Illinois Tech
Skills you'll gain: Computer Hardware, Hardware Architecture, Peripheral Devices, Networking Hardware, Data Storage, Data Storage Technologies, USB, Computer Architecture, System Configuration
University of California San Diego
Skills you'll gain: Integrated Development Environments, GitHub, Git (Version Control System), Internet Of Things, Development Environment, Embedded Software, Software Development Tools, Embedded Systems, Prototyping, Linux, Operating Systems, Peripheral Devices, Command-Line Interface, Computer Hardware, Hardware Architecture, System Configuration
University of California San Diego
Skills you'll gain: Internet Of Things, Embedded Software, Embedded Systems, Peripheral Devices, Computer Hardware, Wireless Networks, Digital Communications, Application Development, Debugging
University of Colorado Boulder
Skills you'll gain: Semiconductors, Electrical Engineering, Electronic Systems, Electronic Components, Physics, Engineering Analysis, Applied Mathematics
Skills you'll gain: Equipment Design, Plant Operations and Management, Manufacturing Processes, Process Engineering, Mechanical Engineering, Manufacturing Operations, Process Control, Manufacturing Standards, Mechanical Design, Engineering Practices, Engineering, Quality Assurance, Engineering Design Process, Thermal Management
University of California San Diego
Skills you'll gain: Mobile Development, Digital Communications, Visualization (Computer Graphics), Application Development, Python Programming, Internet Of Things, Embedded Software, Development Environment, Algorithms
Skills you'll gain: Embedded Systems, Internet Of Things, Vibrations, Civil Engineering, Electronic Systems, Structural Engineering, Maintenance, Repair, and Facility Services, Wireless Networks, Automation, Environmental Monitoring, System Monitoring, Continuous Monitoring, Computer Programming Tools, Electronic Components, Peripheral Devices
University of Colorado Boulder
Skills you'll gain: Semiconductors, Electrical Engineering, Electronic Components, Mathematical Modeling, Physics, Applied Mathematics
- Status: Free
Korea Advanced Institute of Science and Technology(KAIST)
Skills you'll gain: Artificial Intelligence and Machine Learning (AI/ML), Artificial Intelligence, Human Machine Interfaces, Image Analysis, Computer Vision, Manufacturing Processes, Machine Learning, Deep Learning, Process Control
Arizona State University
Skills you'll gain: Manufacturing Processes, Process Engineering, Manufacturing Operations, Production Process, Process Analysis, Machine Controls, Experimentation, Prototyping
University of Illinois Urbana-Champaign
Skills you'll gain: Computational Logic, Application Specific Integrated Circuits, Theoretical Computer Science, Hardware Design, Data Structures, Verification And Validation, Computer-Aided Design, Computer Architecture, Algorithms, Electrical and Computer Engineering, Programming Principles
In summary, here are 10 of our most popular integrated+circuit+packaging+materials courses
- Semiconductor Characterization: Arizona State University
- Computer and Peripheral Hardware: Illinois Tech
- Internet of Things V2: DragonBoardâ„¢ bring up and community ecosystem: University of California San Diego
- Internet of Things: Sensing and Actuation From Devices: University of California San Diego
- Semiconductor Physics: University of Colorado Boulder
- Heavy Manufacturing of Typical Static Equipment: L&T EduTech
- Internet of Things: Multimedia Technologies: University of California San Diego
- CPS Design with ARM Core using MicroPython for Industries: L&T EduTech
- Light Emitting Diodes and Semiconductor Lasers: University of Colorado Boulder
- AI Materials: Korea Advanced Institute of Science and Technology(KAIST)