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Results for "integrated+circuit+packaging+materials"
University of Colorado Boulder
Skills you'll gain: Engineering Design Process, Life Sciences, Engineering, Design Specifications, Engineering Analysis, Technical Design, Research Design, Medical Science and Research, Scientific Methods, Experimentation, Design Strategies, Technical Standard, Open Source Technology
- Status: Free
Pohang University of Science and Technology(POSTECH)
Skills you'll gain: Manufacturing Processes, Manufacturing and Production, Manufacturing Operations, Production Process, Process Engineering, Mechanical Engineering, Engineering, Process Analysis, Physical Science, Environmental Issue
Arizona State University
Skills you'll gain: Semiconductors, Electronic Components, Basic Electrical Systems, Estimation
University of Colorado Boulder
Skills you'll gain: User Research, User Experience Design, User Experience, User Interface and User Experience (UI/UX) Design, Usability, Verification And Validation, Persona (User Experience), Usability Testing, User Centered Design, Internet Of Things, API Design, User Acceptance Testing (UAT), Amazon Web Services, Embedded Systems, Human Computer Interaction, Application Programming Interface (API), Prototyping, Network Protocols, Microservices, User Interface (UI) Design
- Status: Free
Shanghai Jiao Tong University
Skills you'll gain: Engineering, Physics, Manufacturing Processes, Physical Science, Semiconductors, Thermal Management, Mechanics, Failure Analysis
Skills you'll gain: Electronic Components, Basic Electrical Systems, Manufacturing Processes, Environment and Resource Management, Product Lifecycle Management, Thermal Management, Electrical Engineering, Safety and Security, Waste Minimization, Quality Assurance, Emerging Technologies, Product Testing, Innovation
- Status: Free
Yonsei University
Skills you'll gain: Semiconductors, Thermal Management, Engineering, Manufacturing Processes, Physical Science, Electronic Components, Physics, Manufacturing and Production
Arizona State University
Skills you'll gain: Semiconductors, Failure Analysis, Structural Analysis, Electronic Components, Data Analysis Software, Systems Of Measurement, Physics, Experimentation
University of Colorado Boulder
Skills you'll gain: Power Electronics, Semiconductors, Thermal Management, Electronic Systems, High Voltage, Electronic Hardware, Electronic Components, Simulation and Simulation Software, Failure Analysis, Engineering Analysis
University at Buffalo
Skills you'll gain: Product Lifecycle Management, Performance Measurement, Manufacturing Operations, Supply Chain Management, Supply Chain Planning, Enterprise Resource Planning, Material Requirements Planning, Production Management, Data Integration, Business Process Management, Digital Transformation, Data Security, Internet Of Things, Decision Making
Arizona State University
Skills you'll gain: Semiconductors, Electronic Components, Basic Electrical Systems, Electrical Engineering, Manufacturing Processes, Process Control, Systems Of Measurement
University of Colorado Boulder
Skills you'll gain: Semiconductors, Electronic Components, Electronic Systems, Electrical Engineering, Mathematical Modeling
In summary, here are 10 of our most popular integrated+circuit+packaging+materials courses
- Engineering Genetic Circuits: Design: University of Colorado Boulder
- Ferrous Technology I: Pohang University of Science and Technology(POSTECH)
- Fundamentals of Semiconductor Characterization: Arizona State University
- Embedded Interface Design: University of Colorado Boulder
- Fundamentals of Materials Science: Shanghai Jiao Tong University
- Innovations in Lithium Battery Technology: Starweaver
- Advanced Functional Ceramics: Yonsei University
- Optical and X-Ray Characterization: Arizona State University
- Introduction to Power Semiconductor Switches: University of Colorado Boulder
- Advanced Manufacturing Enterprise: University at Buffalo