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Results for "integrated+circuit+packaging+materials"
University of Colorado Boulder
Skills you'll gain: Semiconductors, Electrical Engineering, Electronic Systems, Electronic Components, Mathematical Modeling, Applied Mathematics
- Status: Free
Pohang University of Science and Technology(POSTECH)
Skills you'll gain: Engineering, Manufacturing Processes, Mechanical Engineering, Engineering Analysis, Manufacturing and Production, Failure Analysis, Physical Science, Mechanics, Process Development
University of Illinois Urbana-Champaign
Skills you'll gain: Application Specific Integrated Circuits, Hardware Design, Computer-Aided Design, Electronic Hardware, Systems Design, Computer Architecture, Electrical and Computer Engineering, Engineering Design Process, Semiconductors, Network Routing, Computational Logic, Network Model, Data Structures, Algorithms, Graph Theory, Linear Algebra, Applied Mathematics, Mathematical Modeling, Calculus
University of Colorado Boulder
Skills you'll gain: Internet Of Things, API Design, Amazon Web Services, Application Programming Interface (API), Network Protocols, Microservices, Cloud Applications, Cloud Platforms, Embedded Systems, Serverless Computing, Cybersecurity, Cloud Computing, Software Development, Wireless Networks
Skills you'll gain: Embedded Systems, Machine Controls, Electronic Systems, Automation, Power Electronics, Engineering, Electronic Components, Basic Electrical Systems, Mechanical Design, Mechanical Engineering, Hydraulics, Thermal Management, Matlab, Real Time Data
University of Colorado Boulder
Skills you'll gain: User Research, User Experience Design, User Experience, User Interface and User Experience (UI/UX) Design, Usability, Verification And Validation, Persona (User Experience), Usability Testing, User Centered Design, User Acceptance Testing (UAT), Embedded Systems, Wireframing, Prototyping, Unified Modeling Language
- Status: Free
Technion - Israel Institute of Technology
Skills you'll gain: Semiconductors, Innovation, Environmental Monitoring, Electronic Systems, Engineering, Manufacturing Processes, Scientific Methods, Research Reports, Health Care
University of Colorado Boulder
Skills you'll gain: Electrical Engineering, Semiconductors, Electronic Systems, Electronic Components, Equipment Design, Engineering Calculations, Performance Testing, Mathematical Modeling
Skills you'll gain: Embedded Systems, Industrial Engineering, Internet Of Things, C (Programming Language), Electronic Systems, Peripheral Devices, Wireless Networks, Computer Architecture, Cybersecurity, Cloud Computing, Computer Hardware, Computer Programming, Real Time Data
Arizona State University
Skills you'll gain: Basic Electrical Systems, Electronic Components, Prototyping, Electronic Hardware, Electrical Wiring, Electrical Engineering, Embedded Systems, Machine Controls, Simulations
Indian Institute of Science
Skills you'll gain: Semiconductors, Hardware Design, Electronic Systems, Embedded Systems, Electrical Engineering, Mechanical Engineering, Manufacturing Processes, Test Engineering, Electronic Components, Engineering Design Process, Systems Integration, Process Development
L&T EduTech
Skills you'll gain: Embedded Systems, Cyber Engineering, Internet Of Things, Automation, Process Control, Electronic Systems, Robotic Process Automation, Hydraulics, Mechanical Engineering, Integration Testing, Cloud Computing, Simulations, Electronic Components, Computer Hardware, Matlab, Computer Programming
In summary, here are 10 of our most popular integrated+circuit+packaging+materials courses
- Diode - pn Junction and Metal Semiconductor Contact: University of Colorado Boulder
- Ferrous Technology II: Pohang University of Science and Technology(POSTECH)
- VLSI CAD Part II: Layout: University of Illinois Urbana-Champaign
- M2M & IoT Interface Design & Protocols for Embedded Systems: University of Colorado Boulder
- CPS Design for Mechatronics, Healthcare, EV & Robotics: L&T EduTech
- UX and Interface Design for Embedded Systems: University of Colorado Boulder
- Nanotechnology and Nanosensors, Part 2: Technion - Israel Institute of Technology
- Nanophotonics and Detectors: University of Colorado Boulder
- Design of CPS with ARM processor using Embedded C: L&T EduTech
- Adding Electronics to Rapid Prototypes: Arizona State University