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Skills you'll gain: Electronic Components, Hardware Design, Schematic Diagrams, Electronic Systems, Software Installation, Manufacturing and Production, Design Software, Electrical Engineering, Computer-Aided Design, Design
- Status: Free
Institut Mines-Télécom
Skills you'll gain: Internet Of Things, Network Protocols, TCP/IP, Embedded Software, Interoperability, Network Analysis, Virtual Machines, Virtual Environment
University of Illinois Urbana-Champaign
Skills you'll gain: Environmental Social And Corporate Governance (ESG), Food and Beverage, Consumer Behaviour, Environmental Issue, Environment and Resource Management, Corporate Sustainability, Economics, Packaging and Labeling, Public Policies, Emerging Technologies, Policy Analysis, Technology Solutions, Business Technologies
University of Maryland, College Park
Skills you'll gain: Product Roadmaps, Agile Product Development, Backlogs, DevOps, Lean Methodologies, Analytics, Agile Methodology, Data-Driven Decision-Making, Data Analysis, Product Management, Data Management, Operational Efficiency, Risk Management, Data Science, Product Development, Innovation, Product Strategy
In summary, here are 4 of our most popular future+trends+and+innovation+in+semiconductor+packaging courses
- Learn the Art and Science of PCB Design with Eagle: Packt
- SCHC : A new era of interoperability: Institut Mines-Télécom
- Modern Issues in Food & Agriculture: University of Illinois Urbana-Champaign
- Product Management: Data Science and Agile Systems: University of Maryland, College Park