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Results for "integrated+circuit+packaging+materials"
Georgia Institute of Technology
Skills you'll gain: Electronic Components, Semiconductors, Electronic Systems, Electrical Engineering, Basic Electrical Systems, Engineering Analysis, Schematic Diagrams
University of Colorado Boulder
Skills you'll gain: Field-Programmable Gate Array (FPGA), Hardware Design, Electronic Hardware, Electronic Systems, Embedded Systems, Systems Design, Application Specific Integrated Circuits, Embedded Software, Semiconductors, Schematic Diagrams, Technical Design, System Programming, Electrical and Computer Engineering, System Design and Implementation, Software Development, Integrated Development Environments, Functional Design, Verification And Validation, Software Design, Computer Architecture
Johns Hopkins University
Skills you'll gain: Hardware Design, Electronic Hardware, Schematic Diagrams, Computer-Aided Design, Mechanical Design, Electrical Engineering, 3D Modeling, Electronic Components, Simulation and Simulation Software, Simulations, Technical Design, Engineering Design Process
Skills you'll gain: 3D Modeling, Computer-Aided Design, Drafting and Engineering Design, Mechanical Design, Simulation and Simulation Software, Assembly Drawing, Engineering Drawings, Prototyping, Engineering Software, Manufacturing Processes
University of California, Irvine
Skills you'll gain: Internet Of Things, Application Programming Interface (API), TCP/IP, Embedded Systems, Network Protocols, USB, General Networking, Electronic Hardware, Systems Design, Hardware Design, Computer Hardware, Peripheral Devices, Electrical Engineering, Servers
University of Colorado Boulder
Skills you'll gain: Embedded Software, Embedded Systems, Debugging, Data Structures, System Programming, Microarchitecture, C (Programming Language), Hardware Architecture, Computer Architecture, Integrated Development Environments, Software Design, Maintainability, System Configuration, Peripheral Devices
Arizona State University
Skills you'll gain: Statistical Process Controls, Process Control, Semiconductors, Quality Assurance, Verification And Validation, Manufacturing Operations, Manufacturing Processes, Process Engineering, Hardware Design, Process Analysis, Reliability, Electronic Components, Electronic Systems, Power Electronics, Computer Hardware, Electrical and Computer Engineering, Computer Architecture, Engineering, Thermal Management, Scalability
- Status: Free
University of California, Davis
Skills you'll gain: Semiconductors, Engineering, Mechanical Engineering, Failure Analysis, Manufacturing Processes, Structural Analysis, Thermal Management, Electronic Components, Mechanics, Physical Science, Electronic Systems
Arizona State University
Skills you'll gain: Failure Analysis, Semiconductors, Manufacturing Processes, Structural Analysis, Mechanical Engineering, Thermal Management, Engineering, Process Control, Mechanics, Physical Science, Physics, Civil Engineering, Process Engineering, Product Testing, Engineering Calculations, Engineering Analysis, Electronic Components, General Science and Research
Arizona State University
Skills you'll gain: Semiconductors, Basic Electrical Systems, Electronic Components, Mechanical Engineering, Electrical Engineering, Electronic Systems, Process Engineering, Thermal Management, Manufacturing Processes, Structural Analysis, Engineering, Process Analysis, Failure Analysis, Engineering Analysis, Process Control, Physical Science, Engineering Calculations, Production Process
Arizona State University
Skills you'll gain: Semiconductors, Basic Electrical Systems, Electronic Components, Electrical Engineering, Electronic Systems
L&T EduTech
Skills you'll gain: Product Lifecycle Management, Embedded Systems, Manufacturing and Production, Robotic Process Automation, Manufacturing Processes, Computer-Aided Design, Automation, Internet Of Things, Production Process, Process Analysis, Cyber Engineering, Digital Transformation, Manufacturing Operations, System Programming, C (Programming Language), Enterprise Resource Planning, Industrial Engineering, Geometric Dimensioning And Tolerancing, Process Control, Electronic Systems
In summary, here are 10 of our most popular integrated+circuit+packaging+materials courses
- Introduction to Electronics: Georgia Institute of Technology
- FPGA Design for Embedded Systems: University of Colorado Boulder
- Designing Hardware for Raspberry Pi Projects: Johns Hopkins University
- Intro to Siemens NX: Engineering Essentials and Part Design: Siemens
- Interfacing with the Raspberry Pi: University of California, Irvine
- Embedded Software and Hardware Architecture: University of Colorado Boulder
- Semiconductor Packaging: Arizona State University
- Materials Science: 10 Things Every Engineer Should Know: University of California, Davis
- Materials Science for Technological Application: Arizona State University
- Materials Science for Advanced Technological Applications: Arizona State University