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Arizona State University
- Status: Free
Duke University
Arizona State University
University of Colorado Boulder
University at Buffalo
Skills you'll gain: Design and Product, Leadership and Management, Product Lifecycle, Product Management, Strategy and Operations, Product Development, Business Process Management, Product Design, Supply Chain Systems, Data Management, Systems Design, Computer Networking, Supply Chain and Logistics, Human Computer Interaction, Process Analysis, Technical Product Management, Data Analysis, Project Management, System Security, Cloud Computing, Cyberattacks, Operations Management, Security Engineering, Big Data, Cloud Storage, Communication, Computer Security Models, Interactive Design, Network Security, Security Software, Security Strategy, Software Security, Supplier Relationship Management, Data Analysis Software, Digital Marketing, Machine Learning, Computer Security Incident Management, Data Visualization, Internet Of Things, Exploratory Data Analysis, Business Communication, Computer Graphics, Marketing
University at Buffalo
Skills you'll gain: Data Analysis Software, Design and Product, Big Data, Data Visualization, Exploratory Data Analysis, Leadership and Management
University of Colorado Boulder
- Status: Free
Columbia University
L&T EduTech
In summary, here are 10 of our most popular manufacturing+techniques+for+semiconductor+packaging courses
- Semiconductor Packaging: Arizona State University
- Nanotechnology: A Maker’s Course: Duke University
- Semiconductor Packaging Manufacturing : Arizona State University
- Overview of Automotive SPICE: EDUCBA
- Sensors and Sensor Circuit Design: University of Colorado Boulder
- Digital Manufacturing & Design Technology: University at Buffalo
- Advanced Manufacturing Process Analysis: University at Buffalo
- Chip based VLSI design for Industrial Applications: L&T EduTech
- Sensor Manufacturing and Process Control: University of Colorado Boulder
- MOS Transistors: Columbia University