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Learner Reviews & Feedback for Advanced Semiconductor Packaging by Arizona State University

4.7
stars
69 ratings

About the Course

Throughout this course, you will be introduced to Pathway for Assembly and Packaging technologies for 7-nanometer silicon feature sizes and beyond. The course will present the evolution and impact of packaging on product performance and innovation. Specifically, we highlight how packaging has enabled better products via the use of heterogeneous integration by improving the interconnects for thermal management and signal integrity....

Top reviews

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1 - 12 of 12 Reviews for Advanced Semiconductor Packaging

By Basil E

•

Feb 6, 2024

This course provides a great overview and Roadmap for Heterogeneous Integration and Advanced packaging. A great starting point for anyone who wants to explore the world of HI.

By 2023 1

•

Mar 10, 2024

Good and Informative Course!

By Sachin P

•

Sep 21, 2024

very good

By Perez C J

•

Nov 1, 2024

excelent

By 민건희

•

May 15, 2024

Good.

By Swetha r G

•

Sep 11, 2024

good

By Sonal

•

Nov 22, 2024

-

By Ranganath K

•

Mar 29, 2024

Very well deliverd and extremely pleased with the contents

By 01fe20bec164

•

Oct 18, 2024

-

By Boyi F

•

Nov 15, 2023

I hope this class can provide more detailed introduction of advanced packaging techniques, such CoWoS, EMIB, CPO....

By Gonçalo S

•

Dec 6, 2024

Should be more detailed oriented. Target public seems to be marketing

By lucas n

•

Sep 19, 2024

As a pioneer in the industry, Intel should share more detailed materials or case studies, especially considering the advancements and maturity of packaging, assembly, and testing since Moore's era.