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Learner Reviews & Feedback for Semiconductor Packaging Manufacturing by Arizona State University

4.7
stars
46 ratings

About the Course

This course will provide information on the various stages of semiconductor package manufacturing, including sort, assembly, and final test. In addition, we will also describe how to select, build, and test the packages with the die and other components to ensure the quality of the package and total assembly performance. We will also discuss the role of Process Control Systems in semiconductor manufacturing as they relate to quality testing. Specifically, we will explore how Process Control Systems can help identify and correct process problems that cause variation and quality issues. Finally, we also demonstrate how to use control charts to monitor the process performance. These can assist in decision-making, specifically when to take action to improve the process....

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1 - 9 of 9 Reviews for Semiconductor Packaging Manufacturing

By Aluth P D R P

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Dec 8, 2024

I appreciate This course and the insights you shared throughout the knowledge. This has been a rewarding learning experience, and I’m grateful for your guidance and support.

By Đặng Q V

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Oct 5, 2023

The course provides me with a lot of knowledge and experience. It could be helpful for me in my job.

By Oscar M 毛

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Dec 5, 2023

Very informative, thanks for the content!

By ASRI,Reena

•

Jun 28, 2024

very well explained

By Satyam B

•

Jul 19, 2024

Outstanding !!

By Sachin P

•

Sep 21, 2024

very good

By 민건희

•

May 15, 2024

Good.

By Perez C J

•

Nov 4, 2024

nice

By lucas n

•

Sep 20, 2024

As a pioneer in the industry, Intel should share more detailed materials or case studies, especially considering the advancements and maturity of packaging, assembly, and testing since Moore's era.