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Results for "future+trends+and+innovation+in+semiconductor+packaging"
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University of California San Diego
Skills you'll gain: Pollution Prevention, Environmental Policy, Environment and Resource Management, Natural Resource Management, Environment, Socioeconomics, Social Sciences, Public Policies, Civil Engineering, Economics, Life Sciences
L&T EduTech
Skills you'll gain: Product Lifecycle Management, Embedded Systems, Manufacturing and Production, Robotic Process Automation, Manufacturing Processes, Computer-Aided Design, Automation, Internet Of Things, Production Process, Process Analysis, Cyber Engineering, Digital Transformation, Manufacturing Operations, System Programming, C (Programming Language), Enterprise Resource Planning, Industrial Engineering, Geometric Dimensioning And Tolerancing, Process Control, Electronic Systems
L&T EduTech
Skills you'll gain: Machine Learning Algorithms, Internet Of Things, Computer Vision, Artificial Intelligence, Unsupervised Learning, Python Programming, Embedded Software, Peripheral Devices, Integrated Development Environments, Deep Learning, Applied Machine Learning, Embedded Systems, Machine Learning, Image Analysis, Civil Engineering, Computer Programming Tools, Wireless Networks, Automation, Digital Transformation, Systems Architecture
University of Colorado Boulder
Skills you'll gain: Semiconductors, Electrical Engineering, Electronic Systems, Electronic Components, Physics, Engineering Analysis, Applied Mathematics
Arizona State University
Skills you'll gain: Semiconductors, Electrical and Computer Engineering, Computer Architecture, Thermal Management, Scalability, Electronic Systems, Systems Integration, Electronic Components, System Design and Implementation, Technical Standard, Reliability
Skills you'll gain: Field-Programmable Gate Array (FPGA), Electronic Systems, Application Specific Integrated Circuits, Hardware Design, Serial Peripheral Interface, Computational Logic, Electrical Engineering, Computer Architecture, Schematic Diagrams, Semiconductors, Hardware Architecture, Electronic Components, Power Electronics, Internet Of Things, Embedded Systems, Electronic Hardware, Electrical and Computer Engineering, Microarchitecture, Computer Hardware, Network Protocols
Arizona State University
Skills you'll gain: Semiconductors, Hardware Design, Reliability, Electronic Components, Electronic Systems, Power Electronics, Computer Hardware, Thermal Management, Engineering, Electrical Engineering, Technical Design, Engineering Design Process, Systems Integration, Mechanical Engineering, Technology Roadmaps, Manufacturing Processes
University at Buffalo
Skills you'll gain: Digital Transformation, Data Sharing, Manufacturing Operations, Business Transformation, Product Lifecycle Management, Data Storage, Process Management, Information Management, Innovation, Goal Setting
Skills you'll gain: Product Lifecycle Management, Manufacturing and Production, Robotic Process Automation, Production Process, Automation, Enterprise Resource Planning, Internet Of Things, Digital Transformation, Systems Integration, Computer-Aided Design, Predictive Modeling, Artificial Intelligence, Data Sharing, Augmented Reality
University of Michigan
Skills you'll gain: Internet Of Things, Manufacturing Operations, Manufacturing Processes, Digital Transformation, Technology Roadmaps, Business Technologies, Technology Strategies, Cloud Computing, Emerging Technologies, Strategic Partnership, Operational Efficiency, Business Modeling, Production Process, System Implementation, Business Valuation, Cost Benefit Analysis, Business Strategy, Product Lifecycle Management, Business Logic, Asset Management
Skills you'll gain: Embedded Systems, Embedded Software, Machine Controls, Electronic Systems, Industrial Engineering, Internet Of Things, Automation, Vibrations, System Programming, C (Programming Language), Power Electronics, Peripheral Devices, Wireless Networks, Computer Architecture, Civil Engineering, Cybersecurity, Engineering, Cloud Computing, Structural Engineering, Maintenance, Repair, and Facility Services
Skills you'll gain: Field-Programmable Gate Array (FPGA), Application Specific Integrated Circuits, Computational Logic, Computer Architecture, Hardware Design, Electronic Hardware, Hardware Architecture, Microarchitecture, Electronic Systems, Computer Hardware, Semiconductors, Computer Engineering, Electronic Components, Functional Design, Verification And Validation, Data Storage, Data Storage Technologies
In summary, here are 10 of our most popular future+trends+and+innovation+in+semiconductor+packaging courses
- Our Energy Future: University of California San Diego
- Digital Technology in Manufacturing: L&T EduTech
- Intelligent Digital Factories: L&T EduTech
- Semiconductor Physics: University of Colorado Boulder
- Advanced Semiconductor Packaging: Arizona State University
- Chip based VLSI design for Industrial Applications: L&T EduTech
- Introduction to Semiconductor Packaging: Arizona State University
- Digital Thread: Components: University at Buffalo
- Industry 4.0: PLM, Value Chain, and Smart Factory: L&T EduTech
- Digital Technologies and the Future of Manufacturing: University of Michigan