Results for "integrated+circuit+packaging+materials"
Status: Free TrialArizona State University
Skills you'll gain: Statistical Process Controls, Process Control, Semiconductors, Quality Assurance, Verification And Validation, Electronics Engineering, Manufacturing Operations, Manufacturing Processes, Electronics, Process Improvement, Process Analysis, Product Testing, Reliability, Electronic Components, Electronic Systems, Computer Hardware, Computer Architecture, Thermal Management, Scalability, Systems Integration
Status: Free TrialSkills you'll gain: Field-Programmable Gate Array (FPGA), Electronic Systems, Hardware Design, Application Specific Integrated Circuits, Electronics Engineering, Serial Peripheral Interface, Computational Logic, Electrical Engineering, Computer Architecture, Schematic Diagrams, Semiconductors, Electronic Hardware, Electronics, Electronic Components, Internet Of Things, Embedded Systems, Theoretical Computer Science, Electrical and Computer Engineering, Diagram Design, Programmable Logic Controllers
Status: Free TrialUniversity of Colorado Boulder
Skills you'll gain: Field-Programmable Gate Array (FPGA), Hardware Design, Electronic Hardware, Laboratory Experience, Application Specific Integrated Circuits, Embedded Software, Systems Design, Embedded Systems, Electronics Engineering, Electronic Systems, Electrical and Computer Engineering, Test Case, Verification And Validation, Engineering Documentation, Debugging, Computer Architecture, Software Development, Software Development Tools, Integrated Development Environments, Hardware Architecture
Status: Free TrialUniversity of Colorado Boulder
Skills you'll gain: Semiconductors, Electrical Engineering, Electronic Systems, Electronic Components, Materials science, Electronic Hardware, Electronics, Electrical and Computer Engineering, Physics, Electronics Engineering, Applied Mathematics, Mathematical Modeling
Status: Free TrialArizona State University
Skills you'll gain: Materials science, Failure Analysis, Semiconductors, Manufacturing Processes, Structural Analysis, Mechanical Engineering, Chemical Engineering, Chemistry, Thermal Management, Engineering, Laboratory Testing, Physical Science, Physics, Engineering Analysis, Reliability, Engineering Calculations
University of Colorado Boulder
Skills you'll gain: Embedded Software, Embedded Systems, Debugging, Data Structures, System Programming, Microarchitecture, C (Programming Language), Hardware Architecture, Computer Architecture, Software Design, System Configuration, Development Environment, Peripheral Devices
What brings you to Coursera today?
Status: Free TrialArizona State University
Skills you'll gain: Semiconductors, Electronics Engineering, Computer Architecture, Thermal Management, Scalability, Systems Integration, Materials science, Manufacturing Processes, Technical Standard, Reliability
Status: Free TrialArizona State University
Skills you'll gain: Semiconductors, Electronics, Reliability, Electronic Components, Electronic Systems, Computer Hardware, Thermal Management, Engineering Design Process, Mechanical Design, Technology Roadmaps, Electrical Systems, Manufacturing Processes
Status: Free TrialSkills you'll gain: Embedded Systems, Embedded Software, Robotics, Electronic Systems, PIC Microcontrollers, Computer Systems, Internet Of Things, Automation, Control Systems, C (Programming Language), Peripheral Devices, Wireless Networks, Medical Devices, Electric Power Systems, Computer Architecture, Civil Engineering, Cybersecurity, Public Works, Cloud Computing, Electronic Hardware
Status: Free TrialArizona State University
Skills you'll gain: Semiconductors, Analytical Testing, Electronic Components, Engineering, Scientific, and Technical Instruments, Analytical Chemistry, Failure Analysis, Electronics, Image Analysis, Laboratory Testing, Laboratory Equipment, Production Process, Basic Electrical Systems, Test Equipment, Materials science, Electrical Engineering, Electronic Systems, Manufacturing Processes, Process Control, Electronics Engineering, Laboratory Research
Status: Free TrialUniversity of Minnesota
Skills you'll gain: Semiconductors, Finite Element Methods, Medical Devices, Materials science, Electronics Engineering, Laboratory Testing, Electronics, Quality Assurance, Process Control, Biomedical Engineering, Electronic Systems, Product Testing, Mechanical Design, Manufacturing Processes, Electrical Engineering, Electronic Components, Computer Architecture, Process Engineering, Mechanical Engineering, Emerging Technologies
Status: NewBirla Institute of Technology & Science, Pilani
Skills you'll gain: Electronic Systems, Semiconductors, Basic Electrical Systems, Electrical Engineering, Electronics, Electronic Components, Electronics Engineering, Power Electronics, Electrical Systems, Engineering Analysis, Network Analysis, Engineering Calculations, Control Systems, Applied Mathematics
In summary, here are 10 of our most popular integrated+circuit+packaging+materials courses
- Semiconductor Packaging:Â Arizona State University
- Chip based VLSI design for Industrial Applications:Â L&T EduTech
- FPGA Design for Embedded Systems:Â University of Colorado Boulder
- Semiconductor Devices:Â University of Colorado Boulder
- Materials Science for Technological Application:Â Arizona State University
- Embedded Software and Hardware Architecture:Â University of Colorado Boulder
- Advanced Semiconductor Packaging:Â Arizona State University
- Introduction to Semiconductor Packaging:Â Arizona State University
- VLSI chip design with CPS for Industrial Applications:Â L&T EduTech
- Semiconductor Characterization:Â Arizona State University
